Descripción
Monolithic structure provides higher reliability. A wide range of capacitance values available in standard case sizes. The use of nickel as electrode material and plating processing improve the solderability and heat resistance characteristics. It also prevents migration and raises the level of reliability. Low equivalent series resistance(ESR) provides superior noise absorption characteristics.
Item Summary 4.7 μF ± 10%, 25V, X5R, 0805/2012
Life cycle Stage Mass Production
Standard packaging quantity (minimum) Taping Embossed 3000pcs
Applications
Communication equipment (cellular phone, wireless applications, etc.)
General digital circuit
Power supply bypass capacitors: Liquid crystal modules, Liquid crystal drive voltage lines, LSI, IC, converters (both for input and output)
Smoothing capacitors: DC-DC converters (for both input and output), Switching power supplies (secondary side)
| Atributo | Valor |
|---|---|
| Capacitancia | 4.7µF |
| Tensión | 25V dc |
| Encapsulado | 0805 (2012M) |
| Tipo de Montaje | Montaje en Superficie |
| Dieléctrico | X5R |
| Tolerancia | ±10% |
| Dimensiones | 2 x 1.25 x 1.25mm |
| Longitud | 2mm |
| Profundidad | 1.25mm |
| Altura | 1.25mm |
| Serie | M |
| Máxima Temperatura de Funcionamiento | +85°C |
| Tipo terminal | Soldadura |
| Mínima Temperatura de Funcionamiento | -55°C |
Valoraciones
No hay valoraciones aún.