Descripción
Low Profile – Maximum Height of 1.1 mm
Small Footprint – Footprint Area of 8.45 mm2
Low VF Provides Higher Efficiency and Extends Battery Life
Supplied in 12 mm Tape and Reel
Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
Mechanical Characteristics:
Case: Molded Epoxy
Weight: 62 mg (approximately)
Device Marking: BCF
Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum for 10 Seconds
All Packages are Pb-Free
PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
| Atributo | Valor |
|---|---|
| Tipo de Montaje | Montaje superficial |
| Tipo de Encapsulado | CASE 457 |
| Corriente Continua Máxima Directa | 1A |
| Tensión Repetitiva Inversa de Pico | 20V |
| Configuración de diodo | Simple |
| Tipo de Rectificador | Rectificador Schottky |
| Tipo de Diodo | Schottky |
| Conteo de Pines | 2 |
| Número de Elementos por Chip | 1 |
| Tecnología de diodo | Barrera Schottky |
| Transitorios de corriente directa no repetitiva de pico | 50A |
Valoraciones
No hay valoraciones aún.